Tape stiffener and semiconductor device component assemblies including same

ABSTRACT

Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographic processes and may include one layer or two or more superimposed, contiguous, mutually adhered layers. The stiffeners are configured to prevent torsional flexion or bending of the connective structure to which they are to be secured. The stiffeners may include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude. Stiffeners that reinforce sprocket or indexing holes in a connective structure are also disclosed. The stereolithographic method of fabricating the stiffeners may include use of a machine vision system with at least one camera operably associated with a computer that controls the stereolithographic application of material so that the system may recognize the position and orientation of one or more connective structures on which at least an element of each of the stiffeners is to be fabricated.

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation of application Ser. No.09/512,203, filed Feb. 24, 2000, now U.S. Pat. No. 6,740,962, issued May25, 2004.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates generally to tape structures thatare used in assemblies of semiconductor device components, such as theflexible dielectric tapes that are used in tape-automated bonding (TAB)and tape ball grid array (TBGA) packages. Particularly, the tapes of thepresent invention have stiffeners, or support structures, thereon. Morespecifically, the present invention relates to tapes withstereolithographically fabricated stiffeners. The present invention alsorelates to assemblies of semiconductor device components that includethe tapes of the present invention and to stereolithographic methods forfabricating stiffeners on the tapes.

[0004] 2. State of the Art

Tapes Used with Semiconductor Device Components

[0005] In some state of the art semiconductor devices, flexibledielectric tapes with electrical traces thereon are used to connectdifferent semiconductor device components. As a first exemplary use oftapes in semiconductor devices, TAB employs flexible dielectric tapeswith circuit traces thereon to electrically connect differentsemiconductor device components, such as dice and lead frames or circuitboards. In another example of the use of tape in semiconductor devices,a tape with circuit traces thereon may be used as an interposer in aTBGA package to reroute the outputs of a semiconductor device from thebond pad locations on a semiconductor die with which the tape isassembled to different contact pad locations on the tape to whichconductive balls or bumps are mounted.

[0006] Tapes used in assemblies of semiconductor device componentsinclude a thin, flexible dielectric film with conductive traces andcontact pads formed thereon. Typically, the dielectric films of suchtapes are formed from polyimide or other suitable polymers. These filmsare usually only a few mils (e.g., 6 mils) thick to provide a desiredamount of flexibility and to avoid a substantial increase in the overallthickness of an assembly of semiconductor device components thatincludes such an electrically connective tape. The conductive traces andcontact pads on such films may be formed from a suitable conductivematerial, such as copper or aluminum.

[0007] Since these tapes are usually flexible, it is sometimes difficultto hold the tape in place to make the desired connections with asemiconductor device component. This is particularly true in TBGApackages, where torsional flexion and bending of the tape areundesirable during bonding of the contact pads of the tape to the bondpads of a semiconductor die. Bending of such tapes is also somewhatundesirable in TAB operations where a row of bond pads, other contactpads, or leads of a semiconductor device component are being bonded toan adjacent row of contact pads on the tape.

[0008] In response to these problems, thicker, less flexible tapes havebeen developed, as have tapes with heavier circuit traces that arepositioned to counteract undesirable flexion or bending. Also, tapesthat are to be used as interposers in TBGA packages are often supportedby a rigid frame, such as a copper or aluminum frame, in order toprevent undesirable torsional flexion and bending of the tape duringassembly with, and bonding to, one or more semiconductor dice. When thearea of the TBGA interposer is relatively large compared to the area ofthe semiconductor die, these frames, or stiffeners, may remain in placeon the tape so as to support the portions of the tape that extendlaterally beyond the periphery of the semiconductor die. Stiffeners thatremain in place with respect to the tape following connection of thetape to a semiconductor die are usually electrically isolated from thecircuits of the TBGA package.

[0009] Exemplary TBGA tapes with metal stiffeners and packages includingthe same are disclosed in U.S. Pat. No. 6,002,169, issued to Chia et al.on Dec. 14, 1999; U.S. Pat. No. 5,844,168, issued to Schueller et al. onDec. 1, 1998; U.S. Pat. No. 5,843,808, issued to Kamezos on Dec. 1,1998; U.S. Pat. No. 5,663,530, issued to Schueller et al. on Sep. 2,1997; U.S. Pat. No. 5,409,865, issued to Karnezos on Apr. 25, 1995; andU.S. Pat. No. 5,397,921, issued to Kamezos on Mar. 14, 1995.

[0010] As shown in FIG. 1, in the assembly of a carrier tape 14 to asemiconductor die to form a TBGA package, several TBGA tapes 14 aretypically connected to one another in an elongate strip 10, similar to aroll of photographic film. A semiconductor die is connected on itsactive surface to each TBGA tape 14 of elongate strip 10. Prior toconnecting a semiconductor die to the next, adjacent tape 14, strip 10is moved laterally. Typically, strip 10 includes sprocket or indexingholes 18 near the top and bottom edges 11, 12 thereof to facilitate suchlateral movement. Conventionally, the entire strip 10 of tapes 14 iscarried on a metal (e.g., copper) stiffener or frame 1. Followingconnection of a semiconductor die to a TBGA tape 14, the semiconductordie-TBGA tape assembly, which forms a TBGA package, is severed fromstrip 10.

[0011] While conventional metal stiffeners provide support to a tape tobe used in a TBGA package, they only support the tape for purposes ofconnection to the semiconductor die and portions of the tape that extendlaterally beyond the periphery of the semiconductor die. Thus, otherportions of the tape that are prone to flexing or damage during assemblyof the tape with a semiconductor die, such as the sprocket or indexingholes of a strip of TBGA tapes, are not reinforced. Due to the relativethinness and delicacy of these portions of the tape, however, suchreinforcement is desirable.

Stereolithography

[0012] In the past decade, a manufacturing technique termed“stereolithography,” also known as “layered manufacturing,” has evolvedto a degree where it is employed in many industries.

[0013] Essentially, stereolithography as conventionally practicedinvolves utilizing a computer to generate a three-dimensional (3-D)mathematical simulation or model of an object to be fabricated, suchgeneration usually effected with 3-D computer-aided design (CAD)software. The model or simulation is mathematically separated or“sliced” into a large number of relatively thin, parallel, usuallyvertically superimposed layers, each layer having defined boundaries andother features associated with the model (and thus the actual object tobe fabricated) at the level of that layer within the exterior boundariesof the object. A complete assembly or stack of all of the layers definesthe entire object, and surface resolution of the object is, in part,dependent upon the thickness of the layers.

[0014] The mathematical simulation or model is then employed to generatean actual object by building the object, layer by superimposed layer. Awide variety of approaches to stereolithography by different companieshas resulted in techniques for fabrication of objects from both metallicand nonmetallic materials. Regardless of the material employed tofabricate an object, stereolithographic techniques usually involvedisposition of a layer of unconsolidated or unfixed materialcorresponding to each layer within the object boundaries, followed byselective consolidation or fixation of the material to at least apartially consolidated, or semi-solid, state in those areas of a givenlayer corresponding to portions of the object, the consolidated or fixedmaterial also at that time being substantially concurrently bonded to alower layer of the object to be fabricated. The unconsolidated materialemployed to build an object may be supplied in particulate or liquidform, and the material itself may be consolidated or fixed, or aseparate binder material may be employed to bond material particles toone another and to those of a previously formed layer. In someinstances, thin sheets of material may be superimposed to build anobject, each sheet being fixed to a next-lower sheet and unwantedportions of each sheet removed, a stack of such sheets defining thecompleted object. When particulate materials are employed, resolution ofobject surfaces is highly dependent upon particle size, whereas when aliquid is employed, surface resolution is highly dependent upon theminimum surface area of the liquid which can be fixed and the minimumthickness of a layer that can be generated. Of course, in either case,resolution and accuracy of object reproduction from the CAD file is alsodependent upon the ability of the apparatus used to fix the material toprecisely track the mathematical instructions indicating solid areas andboundaries for each layer of material. Toward that end, and dependingupon the layer being fixed, various fixation approaches have beenemployed, including particle bombardment (electron beams), disposing abinder or other fixative (such as by ink-jet printing techniques), orirradiation using heat or specific wavelength ranges.

[0015] An early application of stereolithography was to enable rapidfabrication of molds and prototypes of objects from CAD files. Thus,either male or female forms on which mold material might be disposedmight be rapidly generated. Prototypes of objects might be built toverify the accuracy of the CAD file defining the object and to detectany design deficiencies and possible fabrication problems before adesign was committed to large-scale production.

[0016] In more recent years, stereolithography has been employed todevelop and refine object designs in relatively inexpensive materials,and has also been used to fabricate small quantities of objects wherethe cost of conventional fabrication techniques is prohibitive for same,such as in the case of plastic objects conventionally formed byinjection molding. It is also known to employ stereolithography in thecustom fabrication of products generally built in small quantities orwhere a product design is rendered only once. Finally, it has beenappreciated in some industries that stereolithography provides acapability to fabricate products, such as those including closedinterior chambers or convoluted passageways, which cannot be fabricatedsatisfactorily using conventional manufacturing techniques. It has alsobeen recognized in some industries that a stereolithographic object orcomponent may be formed or built around another, pre-existing object orcomponent to create a larger product.

[0017] However, to the inventor's knowledge, stereolithography has yetto be applied to mass production of articles in volumes of thousands ormillions, or employed to produce, augment or enhance products includingother, pre-existing components in large quantities, where minutecomponent sizes are involved, and where extremely high resolution and ahigh degree of reproducibility of results are required. In particular,the inventor is not aware of the use of stereolithography to fabricatestiffeners for tapes that are used to electrically connect semiconductordevices to other semiconductor device components, such as othersemiconductor devices or substrates. Furthermore, conventionalstereolithography apparatus and methods fail to address the difficultiesof precisely locating and orienting a number of pre-existing componentsfor stereolithographic application of material thereto without the useof mechanical alignment techniques or to otherwise assuring precise,repeatable placement of components.

SUMMARY OF THE INVENTION

[0018] The present invention includes stiffeners for use on tapes suchas TBGA tapes and other tapes that may be suitable for use in TABapplications. The present invention also includes tapes with suchstiffeners, as well as semiconductor devices and assemblies includingtapes with such stiffeners.

[0019] The stiffeners of the present invention are preferably fabricatedfrom a dielectric material, such as a dielectric photoimageable polymer.The stiffeners may have any configuration and are preferably shaped toprevent torsional flexion and bending of the tape. For example, astiffener may be located adjacent substantially the periphery of a tape.Alternatively, a stiffener may include one or more elongate, straight ornonlinear elements that traverse the tape. As another alternative, astiffener may include a sheet of material that laterally spreads acrossa portion of the area of the tape. Stiffeners configured as sheets mayinclude apertures through which electrical traces or conductive elementsextend to facilitate electrical connections through the tape.

[0020] The stiffeners of the present invention may also be configured toreinforce sprocket or indexing holes through the tape. For example,elongate stiffeners may be located at the top and bottom of a strip oftape, with sprocket or indexing holes being formed therethrough.Alternatively, rings may be formed around individual sprocket orindexing holes or around groups of sprocket or indexing holes toreinforce same.

[0021] According to another aspect, the present invention includes amethod for fabricating the stiffeners. In a preferred embodiment of themethod, a computer-controlled, 3-D CAD initiated process known as“stereolithography” or “layered manufacturing” is used to fabricate thestiffeners. When stereolithographic processes are employed, eachstiffener is formed as either a single layer or a series ofsuperimposed, contiguous, mutually adhered layers of material.

[0022] The stereolithographic method of fabricating the stiffeners ofthe present invention preferably includes the use of a machine visionsystem to locate tapes on which the stiffeners are to be fabricated, aswell as the features or other components on or associated with the tapes(e.g., circuit traces, contact pads, etc.). The use of a machine visionsystem directs the alignment of a stereolithography system with eachtape for material disposition purposes. Accordingly, the tape need notbe precisely mechanically aligned with any component of thestereolithography system to practice the stereolithographic embodimentof the method of the present invention.

[0023] In a preferred embodiment, the stiffeners to be fabricated uponor positioned upon and secured to a tape or strip of tapes in accordancewith the invention are fabricated using precisely focusedelectromagnetic radiation in the form of an ultraviolet (UV) wavelengthlaser under control of a computer and responsive to input from a machinevision system, such as a pattern recognition system, to fix or cureselected regions of a layer of a liquid photopolymer material disposedon the semiconductor device or other substrate.

[0024] Other features and advantages of the present invention willbecome apparent to those of skill in the art through consideration ofthe ensuing description, the accompanying drawings, and the appendedclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings illustrate exemplary embodiments of theinvention, wherein some dimensions may be exaggerated for the sake ofclarity, and wherein:

[0026]FIG. 1 is a top view of a conventional tape strip with metallicstiffeners secured thereto;

[0027]FIG. 2 is a top view of an exemplary embodiment of a tape stripincluding a first configuration of stiffeners according to the presentinvention, the stiffeners extending adjacent substantially the entireperipheries of the individual tapes of the strip;

[0028]FIG. 2A is a top view of the interlinked stiffeners of the tapeshown in FIG. 2;

[0029]FIG. 3 is a top view schematic representation of an embodiment ofa strip of tape including a second configuration of stiffenerreinforcing the sprocket or indexing holes of the strip;

[0030]FIG. 4 is a top view schematic representation of a strip of tapeincluding a third configuration of stiffener reinforcing the sprocket orindexing holes of the strip;

[0031]FIG. 5 is a top view schematic representation of a fourthconfiguration of stiffener, which has an X-shape;

[0032]FIG. 5A is a top view of a framework of an interlinked pluralityof stiffeners having the configuration illustrated in FIG. 5;

[0033]FIG. 6 is a top view schematic representation of a fifthconfiguration of stiffener, which includes elongate members;

[0034]FIG. 7 is a top view schematic representation of a sixthconfiguration of stiffener, which includes a sheet of material disposedover the tape;

[0035]FIG. 8 is a perspective schematic representation of a TBGA packageincluding the ball grid array tape and stiffener depicted in FIG. 2;

[0036]FIGS. 8A and 8B are exemplary cross-sectional representations ofthe TBGA package of FIG. 8, taken along line 8A-8A, and showing the TBGApackages connected to carrier substrates;

[0037]FIG. 9 is a perspective schematic representation of another TBGApackage including a tape with a stiffener that extends beyond theperiphery of the die of the TBGA package;

[0038]FIG. 10 is a side view schematic representation of the TBGApackage of FIG. 8 connected face-down to a carrier substrate;

[0039]FIG. 11 is a schematic representation of an exemplarystereolithography apparatus that may be employed in the method of thepresent invention to fabricate the stiffeners of the present invention;and

[0040]FIG. 12 is a partial cross-sectional side view of a tape disposedon a platform of a stereolithographic apparatus for the formation of astiffener on the tape.

DETAILED DESCRIPTION OF THE INVENTION Stiffeners

[0041] With reference to FIG. 2, a strip 10 of tapes 14 for use in TBGApackages or other TAB applications is illustrated. Each tape 14, whichmay be a TBGA tape or TAB tape of known configuration, includeselectrically conductive circuit traces 15 (see, e.g., FIG. 6) thereon,some of which lead to contact pads positioned on the opposite side oftape 14. Tape 14 also includes apertures 17 to facilitate the formationof electrical connections therethrough. Sprocket or indexing holes 18are located near the top and bottom edges 11, 12 of strip 10 and areconsistently spaced apart from one another along the top and bottomedges 11, 12 of strip 10 so as to facilitate mechanical engagement andtransport of strip 10.

[0042] A stiffener 20 is secured to each tape 14. Each stiffener 20shown in FIG. 2 extends adjacent the substantial periphery of thecorresponding tape 14. Stiffeners 20 are preferably formed from a rigiddielectric material, such as a photocurable polymer, or photopolymer, toprevent bending or torsional flexion of tape 14. Preferably, stiffeners20 on adjacent tapes 14 are physically separate from one another inorder to permit at least some bending of strip 10. FIG. 2A illustratesthe framework 220 formed by an elongated series of interlinkedstiffeners 20.

[0043] As shown in FIG. 3, stiffeners 20′ according to the presentinvention may also be employed to reinforce sprocket or indexing holes18 or other apertures 17 through tape 14. As illustrated, stiffeners 20′are elongate members positioned adjacent the top and bottom edges 11, 12of strip 10. Stiffeners 20′ include apertures 22′ therethrough, whichare aligned with sprocket or indexing holes 18 of each tape 14. Again,stiffeners 20′ are preferably formed from a dielectric material, such asa photopolymer. The dielectric material from which stiffeners 20′ areformed reinforces sprocket or indexing holes 18 during use thereof toeffect the movement of tape 14. Stiffeners 20′ on adjacent tapes 14 maybe physically separate from one another or extend substantiallycontinuously across the top and bottom edges 11, 12 of strip 10.

[0044]FIG. 4 illustrates a variation of stiffeners 20″ that reinforcesprocket or indexing holes 18 of tape 14. Stiffeners 20″ are separaterings or borders that surround the peripheries of and reinforceindividual sprocket or indexing holes 18.

[0045] Turning now to FIG. 5, another configuration of stiffener20′″includes two intersecting members 24 a′″, 24 b′″, each of whichdiagonally traverse tape 14. Members 24 a′″ and 24 b′″intersect at ornear the center of tape 14, imparting stiffener 20′″ with an X-shape.Members 24 a′″ and 24 b′″ are preferably connected at the point wherethey intersect to enhance both torsional and bending support for tape14. FIG. 5A illustrates the framework 220′″ formed by an elongatedseries of interlinked stiffeners 20′″.

[0046] Another configuration of a stiffener 120 incorporating teachingsof the present invention is depicted in FIG. 6. As shown, stiffener 120includes several elongate members 124 a, 124 b. Elongate members 124 aare substantially straight, while elongate members 124 b are bent,curved, or otherwise nonlinear. Elongate members 124 a, 124 b ofstiffener 120 are preferably arranged upon tape 14 so as to preventundesirable torsional flexion or bending of tape 14. When located on thesame side of tape 14 as that to which a semiconductor die is to besecured, the stiffener 120 structure depicted in FIG. 6 may also beemployed to facilitate alignment of the semiconductor die with tape 14.

[0047]FIG. 6 also shows an exemplary arrangement of contact pads 16 a,16 b and circuit traces 15 on tape 14. Contact pads 16 a, shown inphantom, are located on the side of tape 14 on which a semiconductor dieis to be positioned, thereby facilitating connection between bond padsof the semiconductor die and contact pads 16 a, as known in the art(e.g., by wire bonding, thermocompression bonding, solder balls,conductive epoxy segments, etc.). Circuit traces 15, which are alsoillustrated in phantom, may be at least partially carried by tape 14 onone or both surfaces thereof, as well as internally therethrough.Circuit traces 15 communicate with contact pads 16 a and with contactpads 16 b, which may be located on an opposite side of tape 14 fromcontact pads 16 a and are positioned so as to facilitate electricalconnection of tape 14 and, thus, of a semiconductor die connected totape 14 to a higher level, or carrier, substrate. Alternatively, contactpads 16 a and contact pads 16 b may be located on the same side of tape14. Contact pads 16 a and 16 b are collectively referred to herein ascontact pads 16.

[0048]FIG. 7 illustrates yet another configuration of stiffener 120′,which includes a sheet of dielectric material, such as a photopolymer,that covers at least a portion of the surface area of tape 14 to therebysupport same. Stiffener 120′, as well as other embodiments of stiffenersincorporating teachings of the present invention, may also include otherapertures 126 a′ and 126 b′.

[0049] Referring now to FIGS. 8, 8A, and 8B, a TBGA package 30 isillustrated that includes a semiconductor die 32 and a tape 14 securedto an active surface 33 of semiconductor die 32. Contact pads 16 b towhich conductive structures 28 are secured and the corresponding circuittraces 15 carried by tape 14 are electrically connected, as known in theart (e.g., by wire bonds, thermocompression bonds, solder balls,conductive epoxy segments, etc.), by way of contact pads 16 a tocorresponding bond pads 34 on active surface 33 of semiconductor die 32.Stiffener 20, which is secured to an opposite side of tape 14 thansemiconductor die 32, is preferably positioned so as not to impede theplacement of intermediate conductive elements, such as bond wires 29(FIG. 8B), conductive structures 28, or thermocompression bonds (FIG.8A), between tape 14 and semiconductor die 32. As shown in FIGS. 8A and8B, intermediate conductive elements, such as the illustrated conductivestructures 28, conductive epoxy segments, or a conductivematerial-filled epoxy structure, electrically connect TBGA package 30 toa carrier substrate 40.

[0050] Another embodiment of a TBGA package 30′, depicted in FIG. 9,includes a semiconductor die 32 and a tape 14′ having a greater surfacearea than that of an active surface 33 of semiconductor die 32 to whichtape 14′ is secured. Thus, tape 14′ extends beyond an outer periphery 35of semiconductor die 32. As illustrated, TBGA package 30′ includesconductive structures 28 (e.g., solder bumps or balls) located beyondouter periphery 35 and, thus, tape 14′ also includes circuit traces 15(see, e.g., FIG. 6) that extend beyond outer periphery 35 ofsemiconductor die 32 and contact pads 16 (see, e.g., FIG. 6) that arelocated outside outer periphery 35. Tape 14′ has secured thereto astiffener 120″ that supports the portions thereof that extend laterallybeyond outer periphery 35. As shown in FIG. 9, stiffener 120″ is locatedon the same side of tape 14′ as semiconductor die 32 and does not,therefore, add significantly to the overall thickness of TBGA package30′. Alternatively, stiffener 120″ may be positioned on the oppositeside of tape 14′ from semiconductor die 32. A stiffener 120″ that ispositioned on the opposite side of tape 14′ from semiconductor die 32may also traverse tape 14′ opposite semiconductor die 32 to provideadditional support to TBGA package 30′.

[0051]FIG. 10 illustrates an assembly including TBGA package 30connected in face-down orientation, or flip-chip bonded, to a carriersubstrate 40, as known in the art.

[0052] While a plurality of stiffeners incorporating teachings of thepresent invention (e.g., stiffeners 20, 20′, 20″, 20′″, 120, 120′, and120″, which are collectively referred to hereinafter as stiffeners 20)are preferably substantially simultaneously fabricated on or secured toa collection of tapes 14, such as on a strip 10 of tapes 14, stiffeners20 according to the present invention may also be fabricated on orsecured to a collection of individual or connected tapes 14, or toindividual tapes 14. Alternatively, stiffeners 20 may be substantiallysimultaneously fabricated on or secured to a collection of more than onetype of tape 14. As another alternative, different types of stiffeners20 may be substantially simultaneously fabricated on different tapes 14.

[0053] Stiffeners 20 may be fabricated directly on tapes 14 orfabricated separately from tapes 14, then secured thereto as known inthe art, such as by the use of a suitable adhesive.

[0054] As indicated previously herein, stiffeners 20 are preferablyfabricated from a dielectric photopolymer. Stereolithographic processesare preferably used to fabricate stiffeners 20. Thus, each stiffener 20may include a single layer of at least partially cured photopolymer or aplurality of superimposed, contiguous, mutually adhered layers ofphotopolymer.

Stereolithography Apparatus and Methods

[0055]FIG. 11 schematically depicts various components, and operation,of an exemplary stereolithography apparatus 80 to facilitate thereader's understanding of the technology employed in implementation ofthe method of the present invention, although those of ordinary skill inthe art will understand and appreciate that apparatus of other designsand manufacture may be employed in practicing the method of the presentinvention. The preferred, basic stereolithography apparatus forimplementation of the method of the present invention, as well asoperation of such apparatus, are described in great detail in UnitedStates Patents assigned to 3D Systems, Inc. of Valencia, Calif., suchpatents including, without limitation, U.S. Pat. Nos. 4,575,330;4,929,402; 4,996,010; 4,999,143; 5,015,424; 5,058,988; 5,059,021;5,059,359; 5,071,337; 5,076,974; 5,096,530; 5,104,592; 5,123,734;5,130,064; 5,133,987; 5,141,680; 5,143,663; 5,164,128; 5,174,931;5,174,943; 5,182,055; 5,182,056; 5,182,715; 5,184,307; 5,192,469;5,192,559; 5,209,878; 5,234,636; 5,236,637; 5,238,639; 5,248,456;5,256,340; 5,258,146; 5,267,013; 5,273,691; 5,321,622; 5,344,298;5,345,391; 5,358,673; 5,447,822; 5,481,470; 5,495,328; 5,501,824;5,554,336; 5,556,590; 5,569,349; 5,569,431; 5,571,471; 5,573,722;5,609,812; 5,609,813; 5,610,824; 5,630,981; 5,637,169; 5,651,934;5,667,820; 5,672,312; 5,676,904; 5,688,464; 5,693,144; 5,695,707;5,711,911; 5,776,409; 5,779,967; 5,814,265; 5,850,239; 5,854,748;5,855,718; 5,855,836; 5,885,511; 5,897,825; 5,902,537; 5,902,538;5,904,889; 5,943,235; and 5,945,058. The disclosure of each of theforegoing patents is hereby incorporated herein by this reference.

[0056] With continued reference to FIG. 11 and as noted above, a 3-D CADdrawing of an object to be fabricated in the form of a data file isplaced in the memory of a computer 82 controlling the operation ofapparatus 80 if computer 82 is not a CAD computer in which the originalobject design is effected. In other words, an object design may beeffected in a first computer in an engineering or research facility andthe data files transferred via wide or local area network, tape, disc,CD-ROM, or otherwise as known in the art to computer 82 of apparatus 80for object fabrication.

[0057] The data is preferably formatted in an STL (forSTereoLithography) file, STL being a standardized format employed by amajority of manufacturers of stereolithography equipment. Fortunately,the format has been adopted for use in many solid-modeling CAD programs,so translation from another internal geometric database format is oftenunnecessary. In an STL file, the boundary surfaces of an object aredefined as a mesh of interconnected triangles.

[0058] Apparatus 80 also includes a reservoir 84 (which may comprise aremovable reservoir interchangeable with others containing differentmaterials) of an unconsolidated material 86 to be employed infabricating the intended object. In the currently preferred embodiment,the unconsolidated material 86 is a liquid, photocurable polymer, or“photopolymer,” that cures in response to light in the UV wavelengthrange. The surface level 88 of unconsolidated material 86 isautomatically maintained at an extremely precise, constant magnitude bydevices known in the art responsive to output of sensors withinapparatus 80 and preferably under control of computer 82. A supportplatform or elevator 90, precisely vertically movable in fine,repeatable increments responsive to control of computer 82, is locatedfor movement downward into and upward out of material 86 in reservoir84.

[0059] An object may be fabricated directly on platform 90, or on asubstrate disposed on platform 90. When the object is to be fabricatedon a substrate disposed on platform 90, the substrate may be positionedon platform 90 and secured thereto by way of one or more base supports122 (FIG. 12). Such base supports 122 may be fabricated before orsimultaneously with the stereolithographic fabrication of one or moreobjects on platform 90 or a substrate disposed thereon. These supports122 may support, or prevent lateral movement of, the substrate relativeto a surface 100 of platform 90. Supports 122 may also provide aperfectly horizontal reference plane for fabrication of one or moreobjects thereon, as well as facilitate the removal of a substrate fromplatform 90 following the stereolithographic fabrication of one or moreobjects on the substrate. Moreover, where a so-called “recoater” blade102 is employed to form a layer of material on platform 90 or asubstrate disposed thereon, supports 122 may preclude inadvertentcontact of recoater blade 102, to be described in greater detail below,with surface 100 of platform 90.

[0060] Apparatus 80 has a UV wavelength range laser plus associatedoptics and galvanometers (collectively identified as laser 92) forcontrolling the scan of laser beam 96 in the X-Y plane across platform90. Laser 92 has associated therewith a mirror 94 to reflect laser beam96 downwardly as laser beam 98 toward surface 100 of platform 90. Laserbeam 98 is traversed in a selected pattern in the X-Y plane, that is tosay, in a plane parallel to surface 100, by initiation of thegalvanometers under control of computer 82 to at least partially cure,by impingement thereon, selected portions of material 86 disposed oversurface 100 to at least a partially consolidated (e.g., semisolid)state. The use of mirror 94 lengthens the path of the laser beam,effectively doubling same, and provides a more vertical laser beam 98than would be possible if the laser 92 itself were mounted directlyabove platform surface 100, thus enhancing resolution.

[0061] Referring now to FIGS. 11 and 12, data from the STL filesresident in computer 82 is manipulated to build an object, such as astiffener 20, various configurations of which are illustrated in FIGS.1-10, or base supports 122, one layer at a time. Accordingly, the datamathematically representing one or more of the objects to be fabricatedare divided into subsets, each subset representing a slice or layer ofthe object. The division of data is effected by mathematicallysectioning the 3-D CAD model into at least one layer, a single layer ora “stack” of such layers representing the object. Each slice may be fromabout 0.0001 to about 0.0300 inch thick. As mentioned previously, athinner slice promotes higher resolution by enabling better reproductionof fine vertical surface features of the object or objects to befabricated.

[0062] When one or more base supports 122 are to bestereolithographically fabricated, supports 122 may be programmed as aseparate STL file from the other objects to be fabricated. The primarySTL file for the object or objects to be fabricated and the STL file forbase support(s) 122 are merged.

[0063] Before fabrication of a first layer for a support 122 or anobject to be fabricated is commenced, the operational parameters forapparatus 80 are set to adjust the size (diameter if circular) of thelaser light beam used to cure material 86. In addition, computer 82automatically checks and, if necessary, adjusts by means known in theart the surface level 88 of material 86 in reservoir 84 to maintain sameat an appropriate focal length for laser beam 98. U.S. Pat. No.5,174,931, referenced above and previously incorporated herein byreference, discloses one suitable level control system. Alternatively,the height of mirror 94 may be adjusted responsive to a detected surfacelevel 88 to cause the focal point of laser beam 98 to be locatedprecisely at the surface of material 86 at surface level 88 if level 88is permitted to vary, although this approach is more complex. Platform90 may then be submerged in material 86 in reservoir 84 to a depth equalto the thickness of one layer or slice of the object to be formed, andthe liquid surface level 88 is readjusted as required to accommodatematerial 86 displaced by submergence of platform 90. Laser 92 is thenactivated so laser beam 98 will scan unconsolidated (e.g., liquid orpowdered) material 86 disposed over surface 100 of platform 90 to atleast partially consolidate (e.g., polymerize to at least a semisolidstate) material 86 at selected locations, defining the boundaries of afirst layer 122A of base support 122 and filling in solid portionsthereof. Platform 90 is then lowered by a distance equal to thethickness of second layer 122B, and laser beam 98 is scanned overselected regions of the surface of material 86 to define and fill in thesecond layer while simultaneously bonding the second layer to the first.The process may then be repeated, as often as necessary, layer by layer,until base support 122 is completed. Platform 90 is then moved relativeto mirror 94 to form any additional base supports 122 on platform 90 ora substrate disposed thereon or to fabricate objects upon platform 90,base support 122, or a substrate, as provided in the control software.The number of layers required to erect support 122 or one or more otherobjects to be formed depends upon the height of the object or objects tobe formed and the desired layer thickness 108, 110. The layers of astereolithographically fabricated structure with a plurality of layersmay have different thicknesses.

[0064] If a recoater blade 102 is employed, the process sequence issomewhat different. In this instance, surface 100 of platform 90 islowered into unconsolidated (e.g., liquid) material 86 below surfacelevel 88 a distance greater than a thickness of a single layer ofmaterial 86 to be cured, then raised above surface level 88 untilplatform 90, a substrate disposed thereon, or a structure being formedon platform 90 or a substrate thereon is precisely one layer's thicknessbelow blade 102. Blade 102 then sweeps horizontally over platform 90 or(to save time) at least over a portion thereof on which one or moreobjects are to be fabricated to remove excess material 86 and leave afilm of precisely the desired thickness. Platform 90 is then lowered sothat the surface of the film and surface level 88 are coplanar and thesurface of the unconsolidated material 86 is still. Laser 92 is theninitiated to scan with laser beam 98 and define the first layer 130. Theprocess is repeated, layer by layer, to define each succeeding layer 130and simultaneously bond same to the next-lower layer 130 until all ofthe layers of the object or objects to be fabricated are completed. Amore detailed discussion of this sequence and apparatus for performingsame is disclosed in U.S. Pat. No. 5,174,931, previously incorporatedherein by reference.

[0065] As an alternative to the above approach to preparing a layer ofmaterial 86 for scanning with laser beam 98, a layer of unconsolidated(e.g., liquid) material 86 may be formed on surface 100 of supportplatform 90, on a substrate disposed on platform 90, or on one or moreobjects being fabricated by lowering platform 90 to flood material 86over surface 100, over a substrate disposed thereon, or over the highestcompleted layer of the object or objects being formed, then raisingplatform 90 and horizontally traversing a so-called “meniscus” bladeover platform 90 to form a layer of unconsolidated material having thedesired thickness over platform 90, the substrate, or each of theobjects being formed. Laser 92 is then initiated and a laser beam 98 isscanned over the layer of unconsolidated material to define at least theboundaries of the solid regions of the next-higher layer of the objector objects being fabricated.

[0066] Yet another alternative to layer preparation of unconsolidated(e.g., liquid) material 86 is to merely lower platform 90 to a depthequal to that of a layer of material 86 to be scanned, and to thentraverse a combination flood bar and meniscus bar assembly horizontallyover platform 90, a substrate disposed on platform 90, or one or moreobjects being formed to substantially concurrently flood material 86thereover and to define a precise layer thickness of material 86 forscanning.

[0067] All of the foregoing approaches to liquid material flooding andlayer definition and apparatus for initiation thereof are known in theart and are not material to practice of the present invention, so nofurther details relating thereto will be provided herein.

[0068] In practicing the present invention, a commercially availablestereolithography apparatus operating generally in the manner as thatdescribed above with respect to apparatus 80 of FIG. 11 is preferablyemployed, but with further additions and modifications as hereinafterdescribed for practicing the method of the present invention. Forexample and not by way of limitation, the SLA-250/50HR, SLA-5000 andSLA-7000 stereolithography systems, each offered by 3D Systems, Inc., ofValencia, Calif., are suitable for modification. Photopolymers believedto be suitable for use in practicing the present invention includeCibatool SL 5170 and SL 5210 resins for the SLA-250/50HR system,Cibatool SL 5530 resin for the SLA-5000 and 7000 systems, and CibatoolSL 7510 resin for the SLA-7000 system. All of these photopolymers areavailable from Ciba Specialty Chemicals Inc. of Bezel, Switzerland.

[0069] By way of example and not limitation, the layer thickness ofmaterial 86 to be formed, for purposes of the invention, may be on theorder of about 0.0001 to 0.0300 inch, with a high degree of uniformity.It should be noted that different material layers may have differentheights, so as to form a structure of a precise, intended total heightor to provide different material thicknesses for different portions ofthe structure. The size of the laser beam “spot” impinging on thesurface of material 86 to cure same may be on the order of 0.001 inch to0.008 inch. Resolution is preferably ±0.0003 inch in the X-Y plane(parallel to surface 100) over at least a 0.5 inch×0.25 inch field froma center point, permitting a high resolution scan effectively across a1.0 inch×0.5 inch area. Of course, it is desirable to have substantiallythis high a resolution across the entirety of surface 100 of platform 90to be scanned by laser beam 98, such area being termed the “field ofexposure,” such area being substantially coextensive with the visionfield of a machine vision system employed in the apparatus of theinvention as explained in more detail below. The longer and moreeffectively vertical the path of laser beam 96/98, the greater theachievable resolution.

[0070] Referring again to FIG. 11, it should be noted that apparatus 80useful in the method of the present invention includes a camera 140which is in communication with computer 82 and preferably located, asshown, in close proximity to mirror 94 located above surface 100 ofsupport platform 90. Camera 140 may be any one of a number ofcommercially available cameras, such as capacitive-coupled discharge(CCD) cameras available from a number of vendors. Suitable circuitry asrequired for adapting the output of camera 140 for use by computer 82may be incorporated in a board 142 installed in computer 82, which isprogrammed as known in the art to respond to images generated by camera140 and processed by board 142. Camera 140 and board 142 may togethercomprise a so-called “machine vision system” and, specifically, a“pattern recognition system” (PRS), the operation of which will bedescribed briefly below for a better understanding of the presentinvention. Alternatively, a self-contained machine vision systemavailable from a commercial vendor of such equipment may be employed.For example, and without limitation, such systems are available fromCognex Corporation of Natick, Mass. For example, the apparatus of theCognex BGA Inspection Package™ or the SMD Placement Guidance Package™may be adapted to the present invention, although it is believed thatthe MVS-8000™ product family and the Checkpoint® product line, thelatter employed in combination with Cognex PatMax™ software, may beespecially suitable for use in the present invention.

[0071] It is noted that a variety of machine vision systems are inexistence, examples of which and their various structures and uses aredescribed, without limitation, in U.S. Pat. Nos. 4,526,646; 4,543,659;4,736,437; 4,899,921; 5,059,559; 5,113,565; 5,145,099; 5,238,174;5,463,227; 5,288,698; 5,471,310; 5,506,684; 5,516,023; 5,516,026; and5,644,245. The disclosure of each of the immediately foregoing patentsis hereby incorporated herein by this reference.

Stereolithographic Fabrication of the Stiffeners

[0072] In order to facilitate fabrication of one or more stiffeners 20in accordance with the method of the present invention with apparatus80, a data file representative of the size, configuration, thickness andsurface topography of, for example, a particular type and design of tape14 upon which one or more stiffeners 20 are to be mounted is placed inthe memory of computer 82. Also, if it is desired that the stiffeners 20be so positioned on tape 14 taking into consideration features of ahigher-level substrate 40 (see FIG. 10) to which a semiconductor deviceassembly including tape 14 is to be connected, a data filerepresentative of substrate 40 and the features thereof may be placed inmemory.

[0073] One or more tapes 14 may be placed on surface 100 of platform 90for fabrication of stiffeners 20 thereon. If one or more tapes 14 are tobe held on or above support platform 90 by stereolithographically formedbase supports 122, one or more layers of material 86 are sequentiallydisposed on surface 100 and selectively altered by use of laser 92 toform base supports 122.

[0074] Camera 140 is then activated to locate the position andorientation of each tape 14 upon which stiffeners 20 are to befabricated. The features of each tape 14 are compared with those in thedata file residing in memory, the locational and orientational data foreach tape 14 then also being stored in memory. It should be noted thatthe data file representing the design size, shape and topography foreach tape 14 may be used at this juncture to detect physically defectiveor damaged tapes 14 prior to fabricating stiffeners 20 thereon or beforeconducting further processing or assembly of tapes 14 with othersemiconductor device components. Accordingly, such damaged or defectivetapes 14 may be deleted from the process of fabricating stiffeners 20,from further processing, or from assembly with other components. Itshould also be noted that data files for more than one type (size,thickness, configuration, surface topography) of each tape 14 may beplaced in computer memory and computer 82 programmed to recognize notonly the locations and orientations of each tape 14, but also the typeof tape 14 at each location upon platform 90 so that material 86 may beat least partially consolidated by laser beam 98 in the correct patternand to the height required to define stiffeners 20 in the appropriate,desired locations on each tape 14.

[0075] Continuing with reference to FIGS. 11 and 12, the one or moretapes 14 on platform 90 may then be submerged partially below thesurface level 88 of unconsolidated material 86 to a depth greater thanthe thickness of a first layer of material 86 to be at least partiallyconsolidated (e.g., cured to at least a semisolid state) to form thelowest layer 130 of each stiffener 20 at the appropriate location orlocations on each tape 14 or other substrate, then raised to a depthequal to the layer thickness, the surface level 88 of material 86 beingallowed to become calm. Photopolymers that are useful as material 86exhibit a desirable dielectric constant, exhibit low shrinkage uponcure, are of sufficient (i.e., semiconductor grade) purity, exhibit goodadherence to other semiconductor device materials, and have acoefficient of thermal expansion (CTE) similar to the material of tape14. Preferably, the CTE of material 86 is sufficiently similar to thatof tape 14 to prevent undue stressing thereof during thermal cycling ofa semiconductor device including tape 14 in testing, subsequentprocessing, and subsequent normal operation. Exemplary photopolymersexhibiting these properties are believed to include, but are not limitedto, the above-referenced resins from Ciba Specialty Chemicals Inc. Onearea of particular concern is determining resin suitability in thesubstantial absence of mobile ions, and specifically fluorides.

[0076] Laser 92 is then activated and scanned to direct laser beam 98,under control of computer 82, toward specific locations of surface level88 relative to each tape 14 to effect the aforementioned partial cure ofmaterial 86 to form a first layer 20A of each stiffener 20. Platform 90is then lowered into reservoir 84 and raised a distance equal to thedesired thickness of another layer 20B of each stiffener 20, and laser92 is activated to add another layer 20B to each stiffener 20 underconstruction. This sequence continues, layer by layer, until each of thelayers of each stiffener 20 has been completed.

[0077] In FIG. 12, the first layer of stiffener 20 is identified bynumeral 20A, and the second layer is identified by numeral 20B.Likewise, the first layer of base support 122 is identified by numeral122A and the second layer thereof is identified by numeral 122B. Asillustrated, both base support 122 and stiffener 20 have only twolayers. Stiffeners 20 with any number of layers are, however, within thescope of the present invention. The use of a large number of layers maybe employed to substantially simulate the curvature of a solder ball tobe encompassed thereby.

[0078] Each layer 20A, 20B of stiffener 20 is preferably built by firstdefining any internal and external object boundaries of that layer withlaser beam 98, then hatching solid areas of stiffener 20 located withinthe object boundaries with laser beam 98. An internal boundary of alayer may comprise an aperture, a through-hole, a void, or a recess instiffener 20, for example. If a particular layer includes a boundary ofa void in the object above or below that layer, then laser beam 98 isscanned in a series of closely spaced, parallel vectors so as to developa continuous surface, or skin, with improved strength and resolution.The time it takes to form each layer depends upon the geometry thereof,the surface tension and viscosity of material 86, and the thickness ofthat layer.

[0079] Alternatively, stiffeners 20 may each be formed as a partiallycured outer skin extending above a surface of tape 14 and forming a damwithin which unconsolidated material 86 may be contained. This may beparticularly useful where the stiffeners 20 protrude a relatively highdistance 56 from the surface of tape 14. In this instance, supportplatform 90 may be submerged so that material 86 enters the area withinthe dam, raised above surface level 88, and then laser beam 98 activatedand scanned to at least partially cure material 86 residing within thedam or, alternatively, to merely cure a “skin” comprising the contactsurface, a final cure of the material of the stiffeners 20 beingeffected subsequently by broad-source UV radiation in a chamber, or bythermal cure in an oven. In this manner, stiffeners 20 of extremelyprecise dimensions may be formed of material 86 by apparatus 80 inminimal time.

[0080] Once stiffeners 20, or at least the outer skins thereof, havebeen fabricated, platform 90 is elevated above surface level 88 ofmaterial 86 and platform 90 is removed from apparatus 80, along with anysubstrate (e.g., tape 14) disposed thereon and anystereolithographically fabricated structures, such as stiffeners 20.Excess, unconsolidated material 86 (e.g., excess uncured liquid) may bemanually removed from platform 90, from any substrate disposed thereon,and from stiffeners 20. Each tape 14 is removed from platform 90, suchas by cutting the substrate free of base supports 122. Alternatively,base supports 122 may be configured to readily release each tape 14. Asanother alternative, a solvent may be employed to release base supports122 from platform 90. Such release and solvent materials are known inthe art. See, for example, U.S. Pat. No. 5,447,822 referenced above andpreviously incorporated herein by reference.

[0081] Stiffeners 20 and tapes 14 may also be cleaned by use of knownsolvents that will not substantially degrade, deform, or damagestiffeners 20 or tapes 14 to which stiffeners 20 are secured.

[0082] As noted previously, stiffeners 20 may then require postcuring.Stiffeners 20 may have regions of unconsolidated material containedwithin a boundary or skin thereof, or material 86 may be only partiallyconsolidated (e.g., polymerized or cured) and exhibit only a portion(typically 40% to 60%) of its fully consolidated strength. Postcuring tocompletely harden stiffeners 20 may be effected in another apparatusprojecting UV radiation in a continuous manner over stiffeners 20 or bythermal completion of the initial, UV-initiated partial cure.

[0083] It should be noted that the height, shape, or placement of eachstiffener 20 on each specific tape 14 may vary, again responsive tooutput of camera 140 or one or more additional cameras 144 or 146, shownin broken lines, detecting the protrusion of unusually high (or low)preplaced solder balls which could affect the desired distance 56 thatstiffeners 20 will protrude from the surface of tape 14. In any case,laser 92 is again activated to at least partially cure material 86residing on each tape 14 to form the layer or layers of each stiffener20.

[0084] Although FIGS. 11 and 12 illustrate the stereolithographicfabrication of stiffeners 20 on a substrate, such as a tape 14,stiffeners 20 may be fabricated separately from a substrate, thensecured to the substrate by known processes, such as by the use of asuitable adhesive material.

[0085] The use of a stereolithographic process as exemplified above tofabricate stiffeners 20 is particularly advantageous since a largenumber of stiffeners 20 may be fabricated in a short period of time, thestiffener height and position are computer controlled to be extremelyprecise, wastage of unconsolidated material 86 is minimal, soldercoverage of passivation materials is avoided, and the stereolithographymethod requires minimal handling of tape 14.

[0086] Stereolithography is also an advantageous method of fabricatingstiffeners 20 according to the present invention since stereolithographymay be conducted at substantially ambient temperature, the small spotsize and rapid traverse of laser beam 98 resulting in negligible thermalstress upon tape 14 or on the circuit traces 15 or contact pads 16thereof.

[0087] The stereolithography fabrication process may also advantageouslybe conducted at the wafer level or on multiple substrates, savingfabrication time and expense. As the stereolithography method of thepresent invention recognizes specific types of tape 14, variationsbetween individual tapes 14 are accommodated. Accordingly, when thestereolithography method of the present invention is employed,stiffeners 20 may be simultaneously fabricated on different types oftape 14.

[0088] While the present invention has been disclosed in terms ofcertain preferred embodiments, those of ordinary skill in the art willrecognize and appreciate that the invention is not so limited.Additions, deletions and modifications to the disclosed embodiments maybe effected without departing from the scope of the invention as claimedherein. Similarly, features from one embodiment may be combined withthose of another while remaining within the scope of the invention.

1. A connective structure for use in tape-automated bonding, comprising:a nonconductive polymeric film; at least one conductive trace carried bythe polymeric film; and at least one nonconductive stiffener positionedon the polymeric film, the at least one nonconductive stiffenercomprising a plurality of adjacent, mutually adhered regions.
 2. Theconnective structure of claim 1, wherein the at least one nonconductivestiffener comprises at least one elongate, substantially linear member.3. The connective structure of claim 1, wherein the at least onenonconductive stiffener comprises a plurality of elongate, substantiallylinear members.
 4. The connective structure of claim 3, wherein at leasttwo of the plurality of elongate, substantially linear members intersectone another.
 5. The connective structure of claim 3, wherein the atleast one nonconductive stiffener traverses the polymeric film adjacentat least two edges thereof.
 6. The connective structure of claim 1,wherein the at least one nonconductive stiffener comprises at least onenonlinear member.
 7. The connective structure of claim 6, wherein the atleast one nonconductive stiffener is positioned adjacent a periphery ofthe polymeric film.
 8. The connective structure of claim 1, wherein theat least one nonconductive stiffener comprises a sheet that covers atleast a portion of the polymeric film.
 9. The connective structure ofclaim 1, wherein each of the plurality of adjacent, mutually adheredregions comprises photopolymer.
 10. The connective structure of claim 1,further comprising a conductive structure protruding from a surface ofthe polymeric film and in communication with the at least one conductivetrace.
 11. The connective structure of claim 10, comprising a pluralityof conductive traces and a plurality of conductive structures incommunication therewith and protruding from the surface.
 12. Theconnective structure of claim 11, wherein the plurality of conductivestructures are arranged on the surface in an array.
 13. The connectivestructure of claim 1, wherein the at least one nonconductive stiffenerincludes at least one aperture formed therethrough.
 14. The connectivestructure of claim 13, wherein the at least one aperture is aligned witha sprocket hole formed through the nonconductive polymeric film.
 15. Theconnective structure of claim 13, wherein the at least one aperture isconfigured to receive a conductive structure or an intermediateconductive element.
 16. A tape for use in forming a tape ball grid arraypackage, comprising: a polymeric film; a plurality of conductive tracescarried by the polymeric film; a plurality of contact pads positioned ona surface of the polymeric film and arranged thereon in an array, eachof the plurality of conductive pads communicating with a correspondingone of the plurality of conductive traces; conductive structures securedto the plurality of contact pads and protruding from the surface; and atleast one stiffener comprising a plurality of adjacent, mutually adheredregions, each of which comprises a polymer, the at least one stiffenerpositioned on a surface of the polymeric film so as to inhibit bendingthereof and to be superimposed relative to a semiconductor device uponpositioning of the tape adjacent thereto.
 17. The tape of claim 16,wherein the at least one stiffener comprises at last one elongatemember.
 18. The tape of claim 16, wherein the at least one stiffenercomprises a plurality of elongate members.
 19. The tape of claim 18,wherein at least one of the plurality of elongate members issubstantially linear.
 20. The tape of claim 18, wherein selected membersof the plurality of elongate members are substantially linear.
 21. Thetape of claim 20, wherein at least two of the selected members intersectone another.
 22. The tape of claim 18, wherein at least two of theplurality of elongate members extend adjacent different edges of thepolymeric film.
 23. The tape of claim 17, wherein the at least oneelongate member is nonlinear.
 24. The tape of claim 16, wherein the atleast one stiffener comprises a sheet.
 25. The tape of claim 16, whereinthe at least one stiffener extends adjacent substantially an entireperiphery of the polymeric film.
 26. The tape of claim 16, wherein theat least one stiffener includes at least one aperture formedtherethrough.
 27. The tape of claim 26, wherein the at least oneaperture is aligned with a sprocket hole formed through the tape. 28.The tape of claim 16, wherein the at least one stiffener includes atleast one aperture formed therethrough configured to receive aconductive structure or an intermediate conductive element.
 29. A ballgrid array package, comprising: at least one semiconductor die includinga plurality of bond pads on an active surface thereof; and a carriertape including: a polymeric film with a first surface adjacent the atleast one semiconductor die and a second surface opposite the firstsurface; and at least one nonconductive stiffener disposed on at leastone of the first and second surfaces of the polymeric film and includinga plurality of adjacent, mutually adhered regions.
 30. The ball gridarray package of claim 29, wherein the at least one nonconductivestiffener is disposed on the first surface of the polymeric filmlaterally adjacent the at least one semiconductor die.
 31. The ball gridarray package of claim 29, wherein the at least one nonconductivestiffener is disposed on the second surface of the polymeric film andprotrudes therefrom a distance less than heights of each of a pluralityof conductive structures.
 32. The ball grid array package of claim 29,wherein the at least one nonconductive stiffener is an elongate member.33. The ball grid array package of claim 32, wherein the elongate memberis substantially linear.
 34. The ball grid array package of claim 33,wherein the at least one nonconductive stiffener comprises at least twointersecting, substantially linear members.
 35. The ball grid arraypackage of claim 32, wherein the elongate member is nonlinear.
 36. Theball grid array package of claim 29, wherein the at least onenonconductive stiffener comprises a sheet that covers at least a portionof the carrier tape.
 37. The ball grid array package of claim 29,comprising a plurality of stiffeners.
 38. The ball grid array package ofclaim 37, wherein different stiffeners are disposed adjacent differentedges of the polymeric film.
 39. The ball grid array package of claim32, wherein the at least one nonconductive stiffener extends adjacent atleast a portion of a periphery of the polymeric film.
 40. The ball gridarray package of claim 29, wherein the at least one nonconductivestiffener includes at least one aperture formed therethrough.
 41. Theball grid array package of claim 40, wherein the at least one apertureis aligned with a sprocket hole formed through the polymeric film. 42.The ball grid array package of claim 40, wherein the at least oneaperture is configured to receive a conductive structure or anintermediate conductive element.
 43. The ball grid array package ofclaim 42, wherein each conductive structure comprises a solder ball, aconductive epoxy segment, or a conductive material-filled epoxy bump.44. A stiffener configured to be secured to a tape for use intape-automated bonding, comprising at least one dielectric structurecomprising a plurality of adjacent, mutually adhered regions.
 45. Thestiffener of claim 44, wherein the at least one dielectric structure issubstantially linear.
 46. The stiffener of claim 44, comprising aplurality of elongate, substantially linear members.
 47. The stiffenerof claim 46, wherein at least two of the plurality of elongate,substantially linear members intersect one another.
 48. The stiffener ofclaim 44, comprising at least one nonlinear member.
 49. The stiffener ofclaim 44, comprising a sheet of material.
 50. The stiffener of claim 44,wherein each of the plurality of adjacent, mutually adhered regionscomprises photopolymer.
 51. The stiffener of claim 44, comprising atleast one aperture formed therethrough.
 52. The stiffener of claim 51,wherein the at least one aperture is configured to be aligned with asprocket hole of the tape.
 53. The stiffener of claim 51, wherein the atleast one aperture is configured to receive an intermediate conductiveelement.
 54. A connective structure for use in tape-automated bonding,comprising: a polymeric film including at least one sprocket holetherethrough; and a plurality of laterally distinct stiffenerscomprising a polymer and positioned on an opposite surface of thepolymeric film from that to which a semiconductor device is to besecured so as to be superimposed with the semiconductor device uponalignment of the connective structure with the semiconductor device. 55.The connective structure of claim 54, wherein each of the plurality oflaterally distinct stiffeners comprises a plurality of adjacent,mutually adhered regions.
 56. The connective structure of claim 55,wherein each of the plurality of adjacent, mutually adhered regionscomprises photopolymer.
 57. The connective structure of claim 54, atleast one aperture aligned with the at least one sprocket hole of thepolymeric film.
 58. A tape for use in forming a tape ball grid arraypackage, comprising: a polymeric film; and at least one stiffenerpositioned on a surface of the polymeric film so as to inhibit bendingthereof and comprising a plurality of adjacent, mutually adhered regionscomprising dielectric material.
 59. The tape of claim 58, wherein the atleast one stiffener includes at least one aperture formed therethrough.60. The tape of claim 59, wherein the at least one aperture is alignedwith a sprocket hole formed through the tape.
 61. The tape of claim 58,comprising a plurality of laterally distinct stiffeners.
 62. The tape ofclaim 58, wherein the at least one stiffener is positioned so as to besuperimposed with a semiconductor device upon aligning the tape with thesemiconductor device.
 63. A ball grid array package, comprising: atleast one semiconductor die including a plurality of bond pads on anactive surface thereof; and a carrier tape including: a polymeric filmwith a first side adjacent the at least one semiconductor die and asecond side opposite the first side; and at least one nonconductivestiffener disposed on the second side of the polymeric film,superimposed relative to the at least one semiconductor die, andcomprising a plurality of adjacent, mutually adhered regions.
 64. Theball grid array package of claim 63, wherein no stiffeners arepositioned on the first side of the polymeric film.
 65. The ball gridarray package of claim 63, wherein each of the plurality of adjacent,mutually adhered regions comprises photopolymer.
 66. The ball grid arraypackage of claim 63, comprising a plurality of laterally distinctstiffeners.
 67. The ball grid array package of claim 63, wherein the atleast one nonconductive stiffener includes at least one aperture formedtherethrough.
 68. The ball grid array package of claim 67, wherein theat least one aperture is aligned with a sprocket hole formed through thecarrier tape.